Merger & Acquisition Core: RMB 316 Million Cash Purchase of 100% Equity in Xinmai Micro, Targeting Communication Technology Breakthroughs
Recently, Amlogic announced its plan to acquire 100% equity in Xinmai Micro Semiconductor (Jiaxing) Co., Ltd. for a total consideration of RMB 316 million in cash. Public records show that Xinmai Micro Semiconductor was founded in Zhuhai in August 2021, and relocated to Jiaxing, Zhejiang in January 2025 under its current name. Since its establishment, the company has developed rapidly, completing three rounds of financing totaling several hundred million yuan within the past year. Investors include well-known institutions such as Walden International, Legend Capital, and CCV (China Creation Ventures).
Target Company Xinmai Micro: Focusing on IoT/Internet of Vehicles Chips, an Important Force in Domestic Communication Chips
Xinmai Micro Semiconductor specializes in chip design for the Internet of Things (IoT), Internet of Vehicles (IoV), and smartphone markets. Its product portfolio covers key areas such as modems, T-BOX, and C-V2X. To date, the company has completed tape-out for six chip models, with one product already generating client revenue in IoT modules, smart student cards, and mobile intelligent terminals.
In terms of core technology, Xinmai Micro leverages high-integration SOC chip design as its competitive advantage. Its products match international manufacturers in both cost-performance and functionality, effectively lowering the application threshold for customers. The company has become an important participant in the localization of cellular communication chips in China, committed to promoting digital and intelligent transformation across industries through self-developed wireless connectivity technology.
Amlogic: Global Leader in Smart Chips, Building a “Multi-dimensional Communication + End-side Intelligence” Ecosystem Through M&A
Amlogic is a global leader in smart chips, with a market share of nearly 50% in smart set-top box chips. Founded in Silicon Valley in 2003, the company has long served global operators and leading brands, and was among the first listed companies on China’s STAR Market. Its core business focuses on SoC chip research and design, covering five product lines: smart set-top boxes, smart TVs, AI audio-visual terminals, Wi-Fi wireless connectivity, and automotive electronics. Key technologies include full-format video decoding, ultra-high-definition image processing, chip-level security, and low-power solutions. Flagship products (such as the S series set-top box chips supporting 8K decoding) have been applied in terminals for top customers including Xiaomi, Google, and Amazon.
Regarding this acquisition, Amlogic has clearly defined its strategic goal: by integrating Xinmai Micro’s technical assets and R&D team, the company will expand its cellular communication capabilities and enhance its Wi-Fi communication strength. Ultimately, Amlogic aims to build a “cellular communication + optical communication + Wi-Fi” multi-dimensional communication technology stack, forming a pan-AIoT solution with “end-side intelligence + computing power + communication” as its backbone and hardware-software integration as support. This will further penetrate emerging markets such as AIoT, smart homes, and in-vehicle entertainment.
- Technology Feedback and Market Breakthrough: Empowering Semiconductor Equipment and，Sustained High Growth
On the technology application front, Amlogic’s integrated “end-side intelligence + computing power + communication” system can provide reverse support to the semiconductor manufacturing process — specifically for Flexible automatic loading and unloading vibrators:
Leveraging Wi-Fi chip low-latency transmission (delay < 10ms) to achieve real-time data interaction between the vibrator and MES system
Dynamically adapting to chip transportation requirements of different specifications (from 2mm×2mm to 10mm×10mm)
Combining end-side AI to optimize sorting accuracy (posture error within ±0.05mm)
Enabling 7×24-hour continuous production in the chip packaging process
In the automotive field, Amlogic plans to rely on its “multi-dimensional communication technology stack” to meet the “mobile + large bandwidth + multi-connection” requirements of highly intelligent vehicles. The company aims to create an integrated “Zhijiatong” SoC solution for smart cockpits and assisted driving, targeting international leading standards.
In terms of performance, Amlogic achieved revenue of RMB 3.33 billion in the first half of 2025 (up 10.42% year-on-year), with net profit attributable to shareholders of RMB 497 million (up 37.12% year-on-year). In the second quarter, revenue reached RMB 1.801 billion with shipments of nearly 50 million chips, both setting new single-quarter records and providing solid performance support for strategic implementation.
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